Wave Photonics releases expansive PDK for quantum technologies
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Custom PDK Development
Our proprietary design technology enables us to design a custom or application-specific PDK in weeks. We can create state-of-the-art PDKs for any target material or wavelength to fast-track development for customers working on datacoms, sensing and quantum technologies.
Our Fabrication-tolerant PDKs
Wave Photonics creates fabrication-tolerant PDKs for different wavelengths, material processes and applications.

We provide PDKs that support all telecoms bands with applications in telecommunications, data communication and co-packaged optics (CPO). Our visible wavelengths PDK can be used for quantum and AR/VR applications. We are able to generate long wavelengths PDKs which can be used for gas sensing applications. We have designed PDKs for different materials i.e., Silicon-on-Insulator (SOI), Silicon Nitride (SiN), Thin-Film Lithium Niobate (TFLN), and can provide PDK development support for new materials like Aluminium Nitride (AlN), Gallium Arsenide (GaAs) and Silicon Carbide (SiC).
SiNQ PDKs
Telecoms-band PDKs
Wave Photonics’ Telecoms PDKs support multiple wavelengths - O-band, E-band, S-band, C-band, L-band, and U-band and over 500 components. You can also have a streamlined path to a fully packaged device using the QPICPAC packaging service for telecoms applications on multiple platforms. All components also come with fabrication-aware scattering parameters (S-parameters). The Telecoms-band PDKs processes are available from CORNERSTONE. The Telecoms-band PDKs specification can be found here.
Download Telecoms PDK
Custom PDKs
For many applications with exacting requirements, such as high-bandwidth communication for AI and datacentres, gas sensing, and satellite communication, there is a lack of readily available fabrication processes or PDKs - it can be necessary to use dedicated wafer runs on materials like thin-film lithium niobate, aluminium oxide, gallium arsenide, and a range of other materials. For new processes, Wave Photonics’ platform enables the generation of a PDK within weeks of having the required process data. To learn more about PDKs on new processes, get in touch with us.
Get in Touch
Benefits of our PDK Development Offering
Our PDKs can reduce design iterations and shorten product development time while improving yield.
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Wide range of wavelengths
Our components are optimised for a broad range of wavelengths, from visible to telecom bands, for different applications such as quantum, sensing and LiDAR.
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Improve yield/KGDs
Reduced performance variation via fabrication-tolerant design –
component-level measurement showed 50% reduction in performance variation​.
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Get to volume faster
Rapid redesign enables customers using dedicated runs develop with fewer iterations.
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S-parameters, EDA integration & ADK Compatibitliy
Our PDKs come with S-parameters, EDA integration, seamless documentation, and have automatic compatibility with ADKs, packaging, fibre attach and other processes.  
Perfomance Results using our Core Technology
Measurement results using our design technology showed lower optical loss and performance variation compared to conventional inverse design.  
Wave Photonics design
Comparison to conventional inverse design for MMI splitter 70:30 at a visible wavelength
Loss
Inverse design
Split ratio
Variability (upper arm)
Variability (lower arm)
1.3%
69.5:30.5
3.2%
< 0.1 dB
< 2.3%
74:26
0.19 dB
4.3%
2.4%
7.6%
  • 2x lower optical loss
  • 2x lower performance variation
  • Achieved target ratio on first fabrication run
Our Components List
Our flexible designs support multiple wavelengths, splitting ratios, and layout needs. Each component is available in multiple wavelength variants to support diverse PIC designs.

Interested in a component design that is not listed? Contact aidong@wavephotonics.com or fill out our contact form to get in touch with us.
Variants
Production Ready
Crossing
Component
Bend
Taper
MMIs
Mode Converter
Mode MUX (Dual Mode)
Grating Coupler
SM→MM, SM→Grating coupler width
Wide-waveguide (single-mode routing for MM waveguides)
1x2 (50:50, 60:40, 70:30, 80:20, 90:10, 67:33, others on request), 1x3, 1x4, 2x2, 2x4, 4x4 (90° optical hybrid)
TE0→TE1 standard; others on request
TE0+TE1 → TE0, TE0
Customisable coupling angle
Single-mode, Mixed-wavelength, Wide-waveguide
Component
Upon Request
Variants / Notes
Focuses light with variable height above chip (out-of-plane)
Input: TE0, TM0 → Output: TE0, TE1
TE+TM -> TE0, TE0
Inverse taper
Edge Coupler
Interested in a component design that is not listed? Contact aidong@wavephotonics.com or fill out our contact form to get in touch with us.
Polarisation Splitter Rotator
Focusing Grating Coupler
Polarisation Rotator
Component
Coming Soon
Variants / Notes
Enables coupling across different layers in multilayer processes
Improved coupling efficiency for larger mode field diameters
Vertical Layer Coupler
Advanced Edge Coupler
PDK Access Deal for CORNERSTONE 2025 MPW Runs
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We are offering a PDK Access Deal for CORNERSTONE 2025 MPW Runs
Wave Photonics is offering a deal for all CORNERSTONE MPW runs in 2025 with access to all our CORNERSTONE PDKs for £5,000! This means with Wave Photonics’ PDK and the QPICPAC packaging solution for a CORNERSTONE MPW run, you can go from idea to packaged device in 6 months for as low as £14,550 i.e., for an MPW run for SOI passive devices with a 5.5 mm x 4.9 mm design area with single mode fibre array packaging for 1 unit, you can pay £5,000 for Wave Photonics' PDK access, £6,250 for a CORNERSTONE MPW run and £3,300 for the QPICPAC single mode fibre array packaging for 1 unit. Additional pricing for our QPICPAC packaging solution with more units and RF connection can be found here.
Pricing
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How to access our designs
Tape out your next set of chips using our expansive PDKs with components optimised for a wide range of wavelengths.
Design
Design your chips using our black box designs.
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Contact us
We will arrange payment and agree on a date for the swap-out.
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Access designs
We swap out the black boxes and send the design to your chosen fab.
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Tapeout
Your chips get made using the real component designs.
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