Automated Measurement Service
High-throughput, parallelised measurement capability to test and validate your PIC devices for individual dies or wafers up to 8 inches.
Analyse Yield & Variability or Select Known Good Dies (KGDs)
The QPICPAC packaging service is compatible with our wafer-scale measurement service, allowing you to select the best devices for packaging.
Die & Wafer Measurements
We can help you reliably measure various dimensions from a single chip to a whole wafer (up to 8 inches).
Repeatability Tests
We can gather a large quantity of measurement data for your PIC devices to allow for statistical analysis.
Key Benefits of our Measurement Services
Test the performance of your photonic chips using our automated test setup that caters for die and wafer measurements.
01
High Accuracy
Our high quality reliable measurement equipment combined with our automated measurement process controlled by our in-house software, minimises human error and ensures high accuracy.
02
Flexibility
Our setup can be modified to fit different designs. We also offer testing for different wafer sizes (currently available for wafer diameter of 100 mm, 150 mm and 200 mm).
03
Faster testing results
We can run multiple measurements in parallel. This ability for parallel measurements coupled with our automated process allows us to provide testing results in a fraction of the time.
04
Affordable prices
Our testing services are affordable allowing you to quickly test your chips at a competitive price.
How to access tested devices using our measurement service
Leverage our test setup for faster measurement results at affordable prices.
For the best results, Contact us at the design stage to ensure your devices are designed for test.
Design for test
Layout chip in a suitable way for the prober/fibre array.
01
Submit request
Send us measurement information, e.g., device coordinates on the wafer, details of wavelengths etc.
02
Send us your chips
We receive your chips/wafer to be tested.
03
Measure
We perform the measurements using our in-house setup.
04
Process data
We can process measurement data to provide a performance/statistics summary.
05
Receive your chips and results
Receive your chips and mesurement results.
06